| . |
|
|
| Sensor Type |
Optical
(Patented
SEIR method) |
Semiconductor or Chip
(Capacitive) |
| Sensor Surface |
No special treatments or maintenance required |
Usually needs surface treatments, including ESD and
other protective coatings
Coatings may be uneven, wear out over time, degrade
performance, and shorten product lifetime
|
| Overall Durability |
Scratch-proof, unbreakable glass platen made of material
as hard as quartz
Resistant to shock, ESD, and extreme weather
Performs well in high traffic, outdoor or rough environments
|
Corrodes easily from repeated handling and everyday
exposure
Susceptible to damage by electrostatic discharge
Thin silicon chips are inherently fragile and susceptible
to damage by hard external impact and scratches
|
| Imaging Area, Resolution, and Size |
Large imaging area (0.5 inch x 0.6 inch)
High resolution (500 dpi)
Large image size (78,000 pixels)
|
Usually smaller imaging area, image size, and resolution
due to greater cost of manufacturing larger, high quality
chips |
| Cost-Effectiveness |
Low manufacturing cost, long life, no maintenance required |
Consistent quality surface coatings may be expensive
to produce
Replacement, maintenance, and downtime costs can add
up
|
| Warranty |
Up to three years |
Usually one year
|
